Intel has given a close-up of its next-gen Meteor Lake shopper and Granite Rapids knowledge middle CPUs which make the most of superior packaging applied sciences.
Intel Exhibits Off Its Superior Packaging Prowess With Subsequent-Gen Granite Rapids Knowledge Middle & Meteor Lake Consumer CPU Chip Photographs
In a PR printed by Intel, Chipzilla highlights the varied chipmaking applied sciences which might be being utilized at its Arizona and Oregon fabs for the manufacturing of next-gen chips. Intel, whereas being late to the chiplet period, has picked up the tempo just lately with its Sapphire Rapids and Ponte Vecchio not solely being superior chiplet designs however taking it to the subsequent degree by the usage of Foveros and EMIB applied sciences. The corporate’s disaggregated chiplet roadmap additionally takes form later this fall with the launch of Meteor Lake, its first full-on chiplet design, and the primary “Core Extremely” lineup for purchasers.
Following Meteor Lake, Intel will as soon as once more be firing up all barrels within the knowledge middle phase with not one however two distinct Xeon households, the P-Core-based Granite Rapids & the E-Core-based Sierra Forest.
Immediately’s close-up provides us a have a look at the 2nd Gen chiplet-based Knowledge Middle product, Granite Rapids-SP, which might be appropriate with the LGA 4710 socket (Birch Stream platform). This huge chip consists of 5 chiplets with the three within the center being an XCC Compute tile whereas the 2 on the outer sides liable for I/O and extra controllers. Intel additionally reveals off the natural sub-strate layer & which could be seen using not less than 8 EMIB interconnects for every separate chiplet.
An Intel engineer holds a Granite Rapids check package deal publish thermal compression bonding at Intel’s Meeting and Take a look at Expertise Improvement factories in Chandler, Arizona, in July 2023. Intel’s superior packaging applied sciences come to life on the firm’s Meeting and Take a look at Expertise Improvement factories. (Credit score: Intel Company)
An Intel engineer holds a Granite Rapids natural substrate panel that includes Intel’s embedded multi-die interconnect bridge (EMIB) superior packaging expertise at Intel’s Meeting and Take a look at Expertise Improvement factories in Chandler, Arizona, in July 2023. Intel’s superior packaging applied sciences come to life on the firm’s Meeting and Take a look at Expertise Improvement factories. (Credit score: Intel Company)
A photograph from July 2023 reveals an Intel Granite Rapids natural substrate panel that includes Intel’s embedded multi-die interconnect bridge (EMIB) superior packaging expertise. Intel’s superior packaging applied sciences come to life on the firm’s Meeting and Take a look at Expertise Improvement factories in Chandler, Arizona. (Credit score: Intel Company)
An Intel engineer holds a wafer that includes Intel’s embedded multi-die interconnect bridge (EMIB) superior packaging expertise at Intel’s Meeting and Take a look at Expertise Improvement factories in Chandler, Arizona, in July 2023. Intel’s superior packaging applied sciences come to life on the firm’s Meeting and Take a look at Expertise Improvement factories. (Credit score: Intel Company)
A photograph reveals a unit of Intel’s embedded multi-die interconnect bridge (EMIB) expertise on a employee’s finger at Intel’s Meeting and Take a look at Expertise Improvement factories in Chandler, Arizona, in July 2023. Intel’s superior packaging applied sciences come to life on the firm’s Meeting and Take a look at Expertise Improvement factories. (Credit score: Intel Company)
We additionally get a close-up on Intel’s Meteor Lake CPUs and whereas we now have seen the die shot on a number of events, this time we get to see an fascinating package deal that’s coupled with on-die reminiscence. This specific SKU makes use of two LPDDR5x DRAM dies from Samsung (K3KL3L30CM) on the identical package deal & will lead to some very fascinating mobility options, particularly when it comes to measurement & compactness. There may even be the usual off-package DRAM options throughout the Meteor Lake lineup.
Intel’s superior packaging applied sciences lengthen and drive Moore’s Regulation as the corporate aspires to a trillion transistors in a package deal by 2030. Intel has led the trade in superior packaging for a pair many years. Its improvements embrace EMIB (embedded multi-die interconnect bridge) and Foveros, applied sciences that permit a number of chips on a package deal to be linked facet by facet (EMIB) or stacked on high of each other in a 3D vogue (Foveros).
As Moore’s Regulation has been progressing, conventional scaling has been slowing down,” says Ann Kelleher, government vice chairman and normal supervisor of Intel’s Expertise Improvement. “However as we begin doing superior packaging and heterogeneous integration, it means we will pack much more parts right into a given package deal and a given product.
Intel’s packaging expertise can also be a aggressive benefit for Intel Foundry Companies (IFS).
by way of Intel
Intel’s Meteor Lake CPU lineup is anticipated to be unveiled on the upcoming Innovation occasion this month whereas Granite Rapids CPUs are anticipated to ship round mid-2024.
