SUGAR LAND, Texas, Oct. 31, 2023 /PRNewswire/ — Octavo Techniques, a pacesetter in offering extremely built-in System-in-Package deal know-how options, is worked up to announce the manufacturing launch of the highly effective OSDZU3 System-in-Package deal (SiP) and the OSDZU3-REF, an open-source growth and analysis platform. Each merchandise can be found for order via our distribution accomplice, Avnet.
OSDZU3 System-in-Package deal: Efficiency, Flexibility, Integration
The OSDZU3 System-in-Package deal, designed across the AMD Zynq® UltraScale+™ MPSoC, pushes the bounds of what’s doable with SiP integration. It seamlessly integrates important system parts whereas preserving the complete efficiency and adaptability of the ZU3 MPSoC, eliminating the complexities usually inherent in Zynq UltraScale+ Designs.
The OSDZU3 integrates:
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AMD ZU3 MPSoC: That includes 4x Arm® Cortex®-A53 and 2x Arm® Cortex®-R5F processors, a Mali®-400 Based mostly GPU, and UltraScale+ Programmable Logic.
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Energy Administration System: An entire energy administration answer custom-made for the MPSoC and tailor-made to swimsuit a wide range of efficiency necessities.
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2GB LPDDR4 Reminiscence: For prime-speed knowledge processing and storage.
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QSPI Flash and EEPROM: For storage and firmware administration.
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2x Oscillators and Over 100 Passives
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Packaged right into a single 20.5mm X 40mm 600 Ball BGA type issue.
This integration leads to 60% area financial savingsroughly 9 months of design time financial savingsand a decrease whole value of possessionwhereas nonetheless offering entry to all of the efficiency and peripherals obtainable on the ZU3 MPSoC.
Erik WelshCTO at Octavo Techniques, defined that “nice care was taken to make sure that the OSDZU3 may deliver its advantages to the most important variety of functions. Whether or not it is advancing clever decision-making in Edge AI, powering refined medical diagnostics, or enhancing industrial automation processes, the OSDZU3 might be tuned to satisfy the wants of all kinds of functions.”
OSDZU3-REF: Open-Supply Growth Platform:
To accompany the OSDZU3 SiP and assist clients to get began, Octavo Techniques has additionally launched the OSDZU3-REF growth platform. The OSDZU3-REF is an open-source growth platform that comes with an OSDZU3 put in and as a 4-layer design. It’s geared up with helpful peripherals reminiscent of DisplayPort, Sata, USB3.0, Ethernet, growth ports, and comes preinstalled with a Linux distribution with preconfigured Programmable Logic developed by DesignLinx, a member of the Octavo Techniques Accomplice Community. The OSDZU3-REF is the right start line for a ZU3-based utility.
Harley WalshPresident of Octavo Techniques, expressed his enthusiasm, stating, “Getting the OSDZU3 into manufacturing is the fruits of relentless effort and dedication by our distinctive workforce. We proceed to push the boundaries of what’s doable with System-in-Package deal integration, and the OSDZU3 is an instance of our Innovation via Integration mindset and our dedication to high quality.”
Ordering and Availability:
The OSDZU3 System-in-Package deal and the OSDZU3-REF growth platform can be found for instant order via Avnet.
For extra data and to position your orders, please contact your native Avnet or Octavo Techniques gross sales representatives.
About Octavo Techniques:
Octavo Techniques is a number one System-in-Package deal Answer supplier. Octavo Techniques promotes Innovation via Integration by offering extremely built-in system constructing blocks that take away advanced and tedious duties from the electronics design course of, eliminating boundaries for system designers who need the advantages of miniaturization, integration, and simplified provide chains.
https://octavosystems.com
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