AMD’s 3D V-Cache expertise has confirmed to be a well-liked addition to AMD’s processors. Each the PC gaming market and workstation market have benefitted enormously from AMD’s 3D stacked cache tech. Ryzen X3D processors and EPYC Genoa-X processors are in excessive demand as a result of their workload-specific advantages, and Intel can be silly to not engaged on a competing expertise.
At a Q&A session at Intel’s Innovation 2023 occasion, CEO Pat Gelsinger mentioned their strategy to stacked cache, and their plans for the expertise. 3D stacked cache shouldn’t be going to be a part of Intel’s new Meteor Lake processors, however it’s on the corporate’s {hardware} roadmap.
AMD’s Ryzen X3D collection processors use 3D V-Cache chips so as to add additional L3 cache to their processors. This added cache can speed up workloads that profit from quick reminiscence entry, with gaming workloads seeing the biggest beneficial properties. Earlier this 12 months, Gigabyte claimed that “as much as 50%” efficiency beneficial properties are doable because of AMD’s V-Cache. This makes it straightforward to see why Intel needs their very own model of this expertise.
Under is Intel CEO Pat Gelsinger’s response to a query concerning the firm’s plans to compete with AMD’s 3D V-Cache expertise. The response beneath comes by way of Tom’s {Hardware}.
Whenever you reference V-Cache, you’re speaking a couple of very particular expertise that TSMC does with a few of its clients as properly. Clearly, we’re doing that in a different way in our composition, proper? And that exact sort of expertise isn’t one thing that’s a part of Meteor Lake, however in our roadmap, you’re seeing the concept of 3D silicon the place we’ll have cache on one die, and we’ll have CPU compute on the stacked die on prime of it, and clearly utilizing EMIB that Foveros we’ll be capable of compose completely different capabilities.
We really feel excellent that we have now superior capabilities for next-generation reminiscence architectures, benefits for 3D stacking, for each little die, in addition to for very large packages for AI and high-performance servers as properly. So we have now a full breadth of these applied sciences. We’ll be utilizing these for our merchandise, in addition to presenting it to the Foundry (IFS) clients as properly,
3D stacked cache received’t simply assist Intel compete with AMD, it should assist them compete with TSMC
Intel isn’t only a CPU firm. Intel are additionally a silicon foundry that may manufacture chips for third events. Whereas an Intel different to AMD’s V-Cache could also be good for the corporate’s CPU, the flexibility to create merchandise with stacked caches would even be an enormous boon for Intel Foundry Companies (IFS).
AMD’s V-Cache expertise makes use of TSMC’s SoIC packaging expertise. Intel needs to supply their foundry clients related capabilities. Intel is working onerous to ship a 3D silicon future. That future will embrace the flexibility so as to add cache dies to processors utilizing Intel’s Fevoros and EMIB tech.
Proper now, Intel seems to be assured of their 3D manufacturing future. Anticipate to see Intel creating their very own different to AMD’s 3D V-Cache expertise eventually.
You’ll be able to be part of the dialogue on Intel’s 3D cache plans on the OC3D Boards.
