The Tensor G3 chip, which is reportedly made by Samsung and is predicated on its Exynos 2400, could possibly be the primary Samsung Foundry chip to include FO-WLP (Fan-out wafer-level packaging) packaging. This enhanced wafer-level packaging will, in principle, enable for higher effectivity, improved graphics efficiency, and extra power being saved.
FO-WLP has been utilized by Qualcomm and MediaTek, however that is supposedly the primary time Samsung Foundry is utilizing the tech.
The 4nm Tensor G3 shall be contained in the Pixel 8 and Pixel 8 Professional and may have a 9-core CPU – one Cortex-X3 prime core, 4 Cortex-A715s, and 4 Cortex-A510s. For graphics, it can use the 10-core Arm Immortalis G715 GPU – up from the 7-core G710.
The Pixel 8 collection will arrive on October 4.
The Tensor G3 is the primary amongst Samsung Foundry’s smartphone chips to include FO-WLP packaging, which is anticipated to cut back warmth era and enhance energy effectivity for the Tensor G3.
— Revegnus (@Tech_Reve) September 11, 2023
